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IBM to Produce Micron's First Commercial 3D Memory Chips
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IBM to Produce Micron's First Commercial 3D Memory Chips
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7th December 2011, 07:05
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| [M] Reviewer  Join Date: May 2010 Location: Romania
Posts: 9,032
 |  IBM to Produce Micron's First Commercial 3D Memory Chips IBM and Micron Technology, Inc. announced today that Micron will begin production of a new memory device built using the first commercial CMOS manufacturing technology to employ through-silicon vias (TSVs). IBM's advanced TSV chip-making process enables Micron's Hybrid Memory Cube (HMC) to achieve speeds 15 times faster than today's technology. Micron's Hybrid Memory Cube features a stack of individual chips connected by vertical pipelines or "vias," shown above. IBM's new 3-D manufacturing technology, used to connect the 3D micro structure, will be the foundation for commercial production of the new memory cube. http://www.hardocp.com/news/2011/12/...emory_ chips/ |
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