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|18th July 2005, 08:53||#1|
Eastern OC Expert
Join Date: Dec 2004
Rebuild the Winbond honor -GSkill 1GBGH simple test
Tomorrow is typhoon holiday. The mood is good and post some delayed test.
Take a look first.
Equipping with 2 holes Winond UTT. It guarantees DDR400 2 2-2-5 2.7~2.9V.
The same level as the famous Winbond BH5.
* Package : 512MB kit (2x256MB) 1024MB kit (2x512MB) dual channel pack
* IC Spec : Winbond UTT
* CAS Latency : 2-2-2-5 (PC3200)
* Test Voltage : 2.7 ~ 2.9 V
* PCB Board : 6 Layers PCB
* Speed : DDR 400 MHz (PC3200)
* Type : 184-pin DDR SDRAM
* Error Checking : Non-ECC
* Registered/Unbuffered : Unbuffered
* Quality Control : Comprehensive rigorously tested in pair at dual channel environment
* Warranty : Lifetime
OC Winbond chip still needs higher voltage.
Before OC, except the body, well cooling is also impacting the result.
The same as testing OCZ VX PC4000 DDR500 2 2-2-5 3.3V, I use 12X12cm fan.
AMD Athlon64 3000+ 0448&X2 4200+
DFI nF4 LanParty Ultra-D
Testing with Winchester 3000+ 0448SPAW
DDR500 1.5 2-2-0 3.24V
Swap to X2 4200+, it can reach DDR540 SP2004
After comparing Winchester, Venice and X2, we can see the AMD memory controller is getting better.
Combining with DFI LP board, you can reach higher.
Every CPU is different. So you need different BIOS parameters to reach DDR530.
BTW, Winbond chip is still in high C/P.
After adding voltage, it generates more heat. You can add extra cooler to reduce it.
But we cannot see if high voltage will damage the chip in long term use.
As electric moving theory, higher voltage means lower life.
The test above is over office spec. We need better cooling, better memory body and DFI LP board.
I am well trained, please do not copy. Just for your reference
|24th July 2005, 18:03||#6|
Join Date: Mar 2004
My GSkill couldn't do anything close; yes, they offer to replace them.
2.5-4-3-8, yet SuperPI score in 32' - unless we find better use of super tight timing, it may be the dog chasing its tail .
Opteron 165 (2) @2.85 1.42 vcore AMD Stock HSF + Chill Vent II
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