Invensas Licenses xFD Technology, will be Demonstrated in Ultrabooks at CES 2013

Stefan Mileschin · 8th January 2013, 06:38

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., announced today that its new xFD "DIMM-in-a-Package" memory technology has been licensed to an original equipment manufacturer (OEM), and this technology will be demonstrated in Intel-based Ultrabooks at CES 2013. These Ultrabooks contain SK hynix memory chips packaged with Invensas' xFD "DIMM-in-a-Package" memory technology and were built by a leading manufacturer of personal computers. Invensas will showcase the new Ultrabooks at the upcoming Pepcom Digital Experience event being hosted at CES 2013 in Las Vegas.

The DIMM-in-a-Package technology replaces Small-Outline-Dual-Inline-Memory-Modules (SODIMMs), traditionally used in notebook computers, with semiconductor package components that are approximately 80% smaller and offer significant cost and performance benefits. The product is designed to support standard Double-Data-Rate (DDR3 and DDR4) DRAM and Mobile DRAM chips, as well as Intel and ARM based processor architectures.

http://www.techpowerup.com/178335/In...-CES-2013.html

8th January 2013, 06:38	#1
Stefan Mileschin [M] Reviewer Join Date: May 2010 Location: Romania Posts: 148,652	Invensas Licenses xFD Technology, will be Demonstrated in Ultrabooks at CES 2013 Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., announced today that its new xFD "DIMM-in-a-Package" memory technology has been licensed to an original equipment manufacturer (OEM), and this technology will be demonstrated in Intel-based Ultrabooks at CES 2013. These Ultrabooks contain SK hynix memory chips packaged with Invensas' xFD "DIMM-in-a-Package" memory technology and were built by a leading manufacturer of personal computers. Invensas will showcase the new Ultrabooks at the upcoming Pepcom Digital Experience event being hosted at CES 2013 in Las Vegas. The DIMM-in-a-Package technology replaces Small-Outline-Dual-Inline-Memory-Modules (SODIMMs), traditionally used in notebook computers, with semiconductor package components that are approximately 80% smaller and offer significant cost and performance benefits. The product is designed to support standard Double-Data-Rate (DDR3 and DDR4) DRAM and Mobile DRAM chips, as well as Intel and ARM based processor architectures. http://www.techpowerup.com/178335/In...-CES-2013.html

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