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26th January 2024, 06:47 | #1 |
[M] Reviewer Join Date: May 2010 Location: Romania
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| Intel's First High-Volume Foveros Packaging Facility, Fab 9, Starts Operations Intel this week has started production at Fab 9, the company's latest and most advanced chip packaging plant. Joining Intel's growing collection of facilities in New Mexico, Fab 9 is tasked with packaging chips using Intel's Foveros technology, which is currently used to build the company's latest client Core Ultra (Meteor Lake) processors and Data Center Max GPU (Ponte Vecchio) for artificial intelligence (AI) and high-performance computing (HPC) applications. https://www.anandtech.com/show/21246...rts-operations |
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