It appears you have not yet registered with our community. To register please click here...

Go Back [M] > Madshrimps > WebNews
Intel to Manufacture Chipsets Using 90nm Process Technology Intel to Manufacture Chipsets Using 90nm Process Technology
FAQ Members List Calendar Search Today's Posts Mark Forums Read

Intel to Manufacture Chipsets Using 90nm Process Technology
Thread Tools
Old 27th November 2005, 17:12   #1
jmke's Avatar
Join Date: May 2002
Location: 7090/Belgium
Posts: 79,013
jmke has disabled reputation
Default Intel to Manufacture Chipsets Using 90nm Process Technology

As Intel Corp.’s 65nm factories go online, the world’s largest chipmaker is projected to start using its 90nm manufacturing technology to make chipsets. The decision may ease tight supply of Intel’s core-logic products as the company’s fabs that manufacture using 90nm process tech can make more products.

Certain analysts and industry sources recently predicted that Intel’s forthcoming family of chipsets, such as code-named Broadwater core-logic, will be produced using 90nm process technology, which is currently used to make central processing units (CPUs) of the company. The decision will add manufacturing capacities to the firm’s chipset business and will allow the company to ship more core-logic components. As Intel’s microprocessor business shifts to 65nm, more 90nm capacities will be available for chipset manufacturing in addition to already available 130nm fabs.

Currently the majority of Intel Corp.’s chipsets are manufactured using 130nm (or 0.13 micron) fabrication process and using 200mm wafers. By contrast, all Intel’s fabs that can make products using 90nm technology process larger 300mm wafers.

Manufacturing with 300mm wafers increases the ability to produce semiconductors at a lower cost compared with more widely used 200mm wafers. The total silicon surface area of a 300mm wafer is 225% higher compared to 200mm wafer, and the number of printed die (individual computer chips) is increased to 240%. The bigger wafers lower the production cost per chip while diminishing overall use of resources, as manufacturing with 300mm wafers uses 40% less energy and water per chip.

Intel is expected to have five 300mm fabs operating by the end of 2005. Among them are Fab 11X in New Mexico, D1D and D1C in Oregon, Fab 24 in Ireland and Fab 12X in Arizona. Two of them – D1D in Orgegon and Fab 12C in Arizona – produce using 65nm process technologies, whereas others utilize 90nm process technology. Eventually, Intel’s fabs D1D, D1C in Oregon, 12C in Arizona and 24E in Ireland will make chips using 65nm process technology.
jmke is offline   Reply With Quote
Old 27th November 2005, 17:44   #2
Posts: n/a

good, should mean less heat and therfore more passive cooling
  Reply With Quote

Similar Threads
Thread Thread Starter Forum Replies Last Post
Intel: Transition to 32nm Process Technology Becomes Top Priority jmke WebNews 0 16th January 2009 22:16
NVIDIA Brings SLI Technology to Intel Bloomfield CPU Platforms jmke WebNews 1 14th July 2008 22:13
Intel Introduces '3-Series' Chipsets at Computex jmke WebNews 0 5th June 2007 17:40
Intel Reaffirms Intention to Make Chips Using 32nm Process Technology in 2009 jmke WebNews 0 4th December 2005 15:24
Intel Develops "Ultra-Low Power" 65nm Manufacturing Process jmke WebNews 0 22nd September 2005 21:59
Intel Pentium D 820 May Be Incompatible with Third Party Chipsets jmke WebNews 0 26th May 2005 15:01
AMD Transits Sempron to 90nm Process Technology jmke WebNews 0 23rd September 2004 13:20
Intel Advances Intel Centrino Mobile Technology with New Wireless Capabilities Sidney WebNews 0 27th August 2004 06:52
Intel Expands Intel Centrino Mobile Technology Line; New Price Points Sidney WebNews 0 24th June 2004 22:57

Thread Tools

Posting Rules
You may not post new threads
You may not post replies
You may not post attachments
You may not edit your posts

vB code is On
Smilies are On
[IMG] code is On
HTML code is Off
Trackbacks are On
Pingbacks are On
Refbacks are Off

All times are GMT +1. The time now is 11:25.

Powered by vBulletin® - Copyright ©2000 - 2023, Jelsoft Enterprises Ltd.
Content Relevant URLs by vBSEO