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|4th March 2008, 15:19||#1|
Join Date: Mar 2004
33-Way Thermal Interface Material Comparison
Benchmark Reviews has seen a lot of products made for the purpose of delivering better performance. Some of these products exist for overclockers and enthusiasts, and often times help deliver performance out of otherwise tame hardware. Other products sometimes only deliver the empty marketing claim of improvements. Of all the products we have seen and tested, one particular category always stands out as the culprit for over-hyped promises: Thermal Interface Material (TIM). Of all the heatsink compounds and thermal pastes made and marketed, they must all only concentrate themselves to deliver the simple function of mating the CPU to the cooler with the highest thermal conductivity possible. Of course, some work better than others, and this is exactly what Benchmark Reviews intends to discover. Please join us for a comprehensive testing of 33 different TIM products.
Opteron 165 (2) @2.85 1.42 vcore AMD Stock HSF + Chill Vent II
|5th March 2008, 11:27||#3|
|5th March 2008, 14:41||#4|
Not to mention that is just wrong... Thermal output hasn't been "reduced", Intel simply fits "more" into the same TDP. For those that overclock even a dual-core will find the temps quickly climb up there.
My little Q6600 can consume over 200w by its lonesome, with temperatures to match. At 3.2GHz using 1.3v is to hot to operate with an Artic Freezer 7 Pro... But a WC loop lets me operate it stable at 3.2GHz using 1.2v with load temperatures that are better than the AF 7 Pro's IDLE temperatures at the same voltages...
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