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|18th April 2008, 10:39||#1|
Join Date: May 2002
OCZ Announces Ultra-Fast DDR3-2000 with Flex II Water-Cooling Technology
Sunnyvale, CA—April 17, 2008—OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled a blazing fast DDR3 addition to the new Flex II memory series. These premium modules run at incredibly fast 2000MHz speeds at CL8-8-8 timings for added performance to high-end systems with integrated water-cooling. Designed to the very core to offer enthusiasts the thermal management innovation of hybrid water and passive cooling, the new PC3-16000 Flex II Series offers rock-solid stability and performance for your high-end gaming or overclocking system.
The OCZ Flex II heat management solution enables high-frequency memory to operate within an optimal balance of extreme speeds and low latencies without the high temperatures that inhibit or damage the module. Each PC3-16000 Flex II memory module features this breakthrough thermal management technology from OCZ that combines an effective new heatspreader design with integrated liquid injection system and dedicated channels directly over the module’s ICs to effectively dissipate heat produced by high-speed memory. This sophisticated series was engineered with a unique “flexible” design to give enthusiasts the option to run the modules passively or water cooled via the thick array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.
“A data rate of 2GHz was unthinkable only a year ago,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. “Power consumption and heat generation directly follow the operating frequency; therefore, the thermal dissipation of these modules exceeds any specifications of the original design and requires the most advanced thermal solution that will reliably work under any conditions. Whether in a water-cooling environment or else under air-cooling conditions, the legacy of the Flex series continues with the Flex II design as the most advanced memory cooling solution for the fastest modules out there.”The PC3-16000 Flex II modules are optimized for the latest cutting edge DDR3 platforms featuring the new NVIDIA ® 790i chipset and will be available in 2GB (2x1024MB) dual channel kits. In its continued effort to make overclocking a user-friendly pastime, OCZ includes all the necessary accessories right in the box to setup your unique water-cooling system immediately after purchase, without the inconvenience of searching for additional hardware. As part of OCZ’s line-up of premium memory, the Flex II series is backed by a Lifetime Warranty and industry-leading technical support.
Harnessing the elite performance of incredible DDR3 speeds, tight timings, and leading-edge heat dissipation, the unparalleled design of the new Flex II is a complete, all-encompassing solution certain to set a new standard for water-cooling enthusiasts making the leap into the next generation of platforms.
For more information on the OCZ Flex II PC3-16000 2GB Kit, please visit our product page here.
About OCZ Technology Group, Inc.
OCZ Technology Group, a member of JEDEC, designs, develops and manufactures ground-breaking, high performance memory and computer components that set industry standards. OCZ products are the first choice for users needing high-reliability, ultra-high performance solutions. In 2007, PC Power & Cooling and Hypersonic PC were brought into the OCZ Technology Group, forming a well-rounded, highly innovative organization that places the company at the forefront of high-end computing. All of OCZ Technology Group's products are available through its worldwide network of distributors, online resellers and retail stores. For more information visit our website at www.ocztechnology.com
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