MediaTek and Qualcomm upgrade Mobile SoCs

Stefan Mileschin · 30th November 2018, 18:49

Advanced process nodes for 2019

MediaTek and Qualcomm are moving to fabricate their next-generation mobile SoCs with advanced process nodes which will support more advanced technologies.

According to Digitimes, MediaTek is adding an array of AI-based functionalities infused with its in-house developed tri-cluster and heterogeneous computing technologies and upgrading its Helio P- and Helio A-series application processors. Some of these will end up in the high end smartphone segment.

MediaTek will roll out its Helio M70 5G modem chips in the first quarter of 2019, built using a 7nm process at Taiwan Semiconductor Manufacturing Company (TSMC).

Meanwhile Qualcomm is also implementing a comprehensive upgrade program by adding AI-centric functionalities into its Snapdragon 800, 700, 600 and 400 series CPUs.

Qualcomm next-generation high end solutions are using a 7nm process at TSMC to pursue high price/performance ratios for its new chips, while continuing to fabricate the SoCs for the entry-level and mid-range smartphones with a 11nm process at Samsung Electronics.

Qualcomm will roll out integrated 5G solutions with antennas and modems, which in turn will help shore up the ASPs of its 5G chips, Digitimes said.

https://fudzilla.com/news/mobile/477...de-mobile-socs

30th November 2018, 18:49	#1
Stefan Mileschin [M] Reviewer Join Date: May 2010 Location: Romania Posts: 148,618	MediaTek and Qualcomm upgrade Mobile SoCs Advanced process nodes for 2019 MediaTek and Qualcomm are moving to fabricate their next-generation mobile SoCs with advanced process nodes which will support more advanced technologies. According to Digitimes, MediaTek is adding an array of AI-based functionalities infused with its in-house developed tri-cluster and heterogeneous computing technologies and upgrading its Helio P- and Helio A-series application processors. Some of these will end up in the high end smartphone segment. MediaTek will roll out its Helio M70 5G modem chips in the first quarter of 2019, built using a 7nm process at Taiwan Semiconductor Manufacturing Company (TSMC). Meanwhile Qualcomm is also implementing a comprehensive upgrade program by adding AI-centric functionalities into its Snapdragon 800, 700, 600 and 400 series CPUs. Qualcomm next-generation high end solutions are using a 7nm process at TSMC to pursue high price/performance ratios for its new chips, while continuing to fabricate the SoCs for the entry-level and mid-range smartphones with a 11nm process at Samsung Electronics. Qualcomm will roll out integrated 5G solutions with antennas and modems, which in turn will help shore up the ASPs of its 5G chips, Digitimes said. https://fudzilla.com/news/mobile/477...de-mobile-socs

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