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|31st May 2005, 16:21||#1|
JEDEC specs to DDR3
Per this article Desi Rhoden of Inphi stated DDR2-800 will be widespread and should be JEDEC ratified by year's end. DDR3 which has been in development for about three years, should be introduced to market in approximately 2 years. DDR3 will not be a "new" technology and will retain the same basic architecture of DDR2, DDR3 will be a lower voltage, higher frequnecy part. Insofar as bus width and voltages DDR3 will offer 4x, 8x, 16x DDR3 will run at 1.5V , and the modules will be unbuffered DIMM, Registered DIMM and FB-DIMM2. DDR3 modules will be the same size and shape as DDR2 with a few additional pins for more functionality.
Pertaining to the FB-DIMM2 technology (most likely Server based) it will require a AMB (Advanced Mmeory Buffer) device with (as yet) undefined features and a high frequency interface. Desi Rhoden VP at Inphi a USA Fabless electronics company which makes PLL, AMB, and registers gave a speech at VIA is the Chairman of the JC-42 Memory Commitee. He spoke with DigiTimes, and also said the transition to DDR2 will continue, and DDR2 should see a strong year in 2006.
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