Stefan Mileschin

The die is cast

Intel has started production of a new high capacity Field Programmable Gate Array (FPGA) for production emulation systems.

The Stratix 10 is manufactured using an advanced bridging process that logically and electrically stitches together two high-density FPGA dies.

Each die has 5.1 million logic elements, giving the FPGA an extreme density of 10.2 million logic elements to create what Intel claims is the world’s highest capacity FPGA. It has nearly four times the density of its Intel predecessor. Chipzilla said that multiple customers have already received operational samples of the new Intel Stratix 10 GX FPGA,

Intended buyers of the new FPGA include the Application Specific Integrated Circuit (ASIC) prototyping and emulation market, including several companies that build commercial off-the-shelf ASIC systems.

Intel FPGA Vice President of Marketing Patrick Dorsey said prototyping and emulation systems are used by semiconductor companies to verify complex chip designs prior to production to reduce risk.

"Such systems can save semiconductor vendors millions of dollars by helping them identify and eradicate costly hardware and software design bugs before the chips are fabricated”, Dorsey said.

“It’s far more costly to fix hardware design bugs after a chip has been manufactured…Because the risk is so high and the potential savings are so large, these prototyping and emulation systems deliver real, tangible value to IC design teams”, Dorsey said.

https://fudzilla.com/news/pc-hardwar...tratix-10-chip