| ||Thread Tools|
|14th June 2004, 21:19||#1|
Join Date: Mar 2004
Intel Begins 300 mm Production at Newest Wafer Fabrication Facility in Ireland
LEIXLIP, Ireland, Jun 14, 2004 (BUSINESS WIRE) -- Intel Corporation's newest high-volume wafer fabrication facility has commenced production. Fab 24, a $2 billion facility, features 300 mm wafer manufacturing based on Intel's leading 90 nanometer (nm) process technology.
Fab 24 is the company's fourth 300 mm manufacturing facility, making Intel the world leader in 300 mm wafer manufacturing capacity and enabling the company to produce approximately 2.5 times more chips per wafer. Additionally, Fab 24 is Intel's third fab to manufacture semiconductors with circuitry of 90 nm (90 billionths of a meter) across. It would take about 1000 of these circuits to equal the thickness of a typical human hair.
"This new facility is the embodiment of Intel's commitment to high-volume, leading-edge manufacturing capacity," said Craig Barrett, Intel chief executive officer. "The combination of the capital efficiencies gained from 300 mm technology and the outstanding track record of our workforce makes this facility one of the best of its kind anywhere in the world. Intel's leadership in manufacturing technology enables us to meet the requirements of our worldwide customer base."
The larger 300 mm wafers enable lower production costs, reducing the costs per individual component by approximately 30 percent. Additionally, the new technology will use 40 percent less energy and water for each chip than previous generation technologies. The 90 nm process enables a doubling of transistor density on a given integrated chip of the same size. It is also the first in the industry to use a new process technology called "strained silicon" to speed up the transistors. The strained silicon is used to enhance performance. Conversely, it can be used to lower power if additional performance is not required.
Intel has manufactured semiconductors in Ireland since 1990. Other Intel 300 mm fabs are located in Hillsboro, Oregon (D1C and D1D) and Rio Rancho, New Mexico (Fab 11X).
Opteron 165 (2) @2.85 1.42 vcore AMD Stock HSF + Chill Vent II
|Thread||Thread Starter||Forum||Replies||Last Post|
|Intel Confirms 25nm NAND Flash in Mass Production, Heralds New SSD Generation||jmke||WebNews||0||19th May 2010 17:26|
|Intel, TSMC partner up on Atom SoC production||jmke||WebNews||0||2nd March 2009 21:38|
|Intel Builds Fourth 45nm Production Facility||jmke||WebNews||1||27th February 2007 21:10|
|Intel to Build Its Second 45nm Wafer Factory in Israel||jmke||WebNews||0||2nd December 2005 18:48|
|Intel to restart production of entry-level 865GV chipset in 4Q||Sidney||WebNews||1||10th November 2005 03:04|
|Intel Gears Up for 45nm Chip Production: to Begin in 2007||jmke||WebNews||1||26th July 2005 18:12|
|First Multi-Core Silicon Production Begins||Sidney||WebNews||0||7th February 2005 21:29|
|Intel Begins Shipments of 3.60GHz Processors||jmke||WebNews||0||12th July 2004 09:59|
|Intel Begins Shipments of 3.60GHz Processors||Sidney||WebNews||0||8th July 2004 20:15|