| ||Thread Tools|
|18th December 2006, 15:13||#1|
Join Date: May 2002
Hynix Announces Industry’s First 60nm 1Gb DDR2 800MHz Based Modules
SEOUL, South Korea--(BUSINESS WIRE)--Hynix Semiconductor today introduced a family of components and high capacity modules, based on the industry’s first 60nm 1Gb DDR2 DRAM. Hynix is also the first DRAM supplier to be validated by Intel on the 1Gb DDR2 DRAM component, and modules using this component are under evaluation. The successful launch of the 60nm process has established Hynix as a leader in state-of-the-art DRAM design and process development.
The 1GB and 2GB UDIMMs boast operating speeds of 800MHz – the fastest in the industry. As the 60nm process ramps, manufacturing cost of the 1Gb DRAM is expected to decline up to 50% when compared to first generation 80nm technologies, significantly improving Hynix’s cost competitiveness in the industry. The resulting 1Gb package size will allow Hynix to cost-efficiently manufacture 4GB and higher density RDIMMs (Registered DIMM) and FBDIMMs (Fully Buffered DIMM). Planar dual-row assembly, made possible by the small package size, will eliminate the need to stack components in some modules, reducing overall manufacturing costs. Very Low profile (VLP) modules would also be enabled by the small package.
“Our 60nm process has been highly stable, even under worst case conditions,” says Mr. Hong Sung Joo, Hynix VP of Product Development. “Additionally the 3D transistor architecture and triple-metal layer process significantly improves speed-power characteristics of the components,” he said.
The 60nm process based 1Gb 800MHz DDR2 DRAM component and the 2GB module, will go into volume production as the market matures early in the first half of 2007. Hynix will continue to enhance this process for use in future high density DRAM components, and high performance products such as graphic and mobile DRAMs.
With this announcement, Hynix has established its leadership in the rapidly growing DDR2 market place. The company will continue to enhance technology development and marketing of DDR2 products to meet its customers’ requirements.
About Hynix Semiconductor Inc.
Hynix Semiconductor Inc. (HSI) of Icheon, Korea, is the world’s top tier memory semiconductor supplier offering Dynamic Random Access Memory chips (“DRAMs”) and Flash memory chips to a wide range of established international customers. The Company’s shares are traded on the Korea Stock Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about Hynix is available at www.hynix.com
|Thread||Thread Starter||Forum||Replies||Last Post|
|Mushkin Announces XP2-6400 4-4-4 DDR2 eXtreme Modules||jmke||WebNews||0||24th October 2007 09:35|
|OCZ announces new DDR2 Modules - PC2-6400 Gold Rev.2 GX||thorgal||WebNews||0||18th October 2006 11:03|
|Mushkin Announces XP2-8000 REDLINE DDR2 Modules||jmke||WebNews||0||1st June 2006 18:43|
|INFO: overclocking DDR2 memory list||jmke||FAQ / INFO / HOW-TO||0||15th March 2006 11:04|
|Corsair Announces Value Select DDR2 Memory Modules||jmke||WebNews||0||17th June 2004 23:34|
|OCZ to Release 667MHz, 800MHz DDR2 SDRAM||jmke||WebNews||0||26th May 2004 08:36|
|Hynix to Ramp DDR2 Memory Modules Next Month||jmke||WebNews||0||20th May 2004 05:40|
|Hynix Unveils DDR2 Modules for Notebooks||jmke||WebNews||0||29th March 2004 15:48|
|OCZ Announces PC-3200 1GB Unbuffered DDR Memory Modules||jmke||WebNews||0||26th February 2004 09:32|