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|27th November 2005, 17:12||#1|
Join Date: May 2002
AMD Set to Adopt New Interconnect Architecture, DDR3 in Three Years
The world’s second largest maker of x86 microprocessors, Advanced Micro Devices, disclosed plans to introduce enhanced multi-core processors that support built-in DDR3 memory controller as well as to present platform initiatives that allow more than 8 physical chips to be installed into a single system.
By 2008 AMD is set to introduce its so-called Direct Connect architecture 2.0 that would improve interconnection between processors and processing engines within a chip. The new interconnection architecture will allow more than 8 processors to be connected in a single coherent memory system without the need for additional logic devices. The company plans to offer the architecture that will allow to easily build up to 32-way systems.
In addition, AMD, along with its infrastructure partners, plans to incorporate and
support DDR3 memory technology. The first samples of such products are set to emerge in 2007, whereas the first DDR3-supporting products for consumers, such as AMD Athlon 64 and Sempron processors, will be available in 2008, according to the current plans of AMD.
Earlier it was reported that AMD plans to commercially launch quad-core chips, Hyper-Transport 3.0 interconnection protocol, extend AMD64 instruction set, as well as add FB-DIMM support for server processors in 2007.
Among the short-term plans of AMD the company names such features dual-channel DDR2 memory support, virtualization and security capabilities in addition to advanced thermal management and advanced power management features. Chips with such functionality are expected to emerge in 2006.
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