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Expoxy a CPU to waterblok
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Old 8th December 2007, 00:01   #1
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Default Expoxy a CPU to waterblok

Heloo fellows (and ladies) my TIM round-up (almost done) has spurned so many thoughts and ideas. We all know it will be some years before nano-technology allows processors to run without active or any cooling extemporanous cooling device, but until that day the multi-core (quad and above) has heated things up again.

The Phenom 9900 looks to have a 136W TDP rating and Intel's top performaers aren't exactly running at mobile processor TDP's either.

Anyhoo as I test the Thermal Interface Materials, some made with diamond dust, some made with silver or cermaic it occurs to me it serves two purposes both of which are never completely resolved.
1.) to fill "all" micro-pores and striations on and in the heatsink base and IHS surfaces.
2.) conduct thermal energy

Now the latter may seem confusing because of the way the question is posed, however; when I say "never completely resolved" (two universal quantifiers whew) I mean whatever material is uses doesn't have the same ability for conducting thermal energy as the surfaces or rather metals its bringing together.

So my idea is to find a rather hot running Cedar Mill and tes this with several top performing TIMS.

Then use Arctic Silver, Silver Solder and bond the two surfaces. In both circumstances the same pressure will be applied (well you can't really put a processor in a vice) basically I'll use the manufactuer's recommended application.

Amoung the the TIMs used I'll find the one which benefits most froma a similair applications which will most likely be applying a large dollop and then tightening down the heatsink with its supplied mounting kit.

I forsee two problems after talking about this with a friend
1.) there's not going to be any real gains in cooling with solder since it "may" oir may not be intended for thermal transfer over it's second purpose to create a bond. So what will be important is to study what exactly occurs when solder is mixed and applied? Does the chemical reaction have anything to do with removing air? (silly question I know)

Does the chemical interaction with the solder create a better bond and if its filling the gaps in the metal surfaces does it do this better then thermal paste which is soley designed to transfer heat and fill gaps?

Last edited by Liquid3D : 8th December 2007 at 00:32.
Old 8th December 2007, 00:12   #2
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This may help to undertand more.

I'd say it won't be to your satifisfaction as the alloy used is most tin in solder and it won't do the job as good as TIM past being used today.

By the way, how did this thread get to this forum which is for [M] released article/reviews?

Opteron 165 (2) @2.85 1.42 vcore AMD Stock HSF + Chill Vent II

Last edited by Sidney : 8th December 2007 at 00:20.
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Old 8th December 2007, 00:30   #3
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About tin as a metal that's why I stated above using Arctic Silver Silver Epoxy...

Arctic Silver Silver Thermal Adhesive

Last edited by Liquid3D : 8th December 2007 at 13:44.
Old 8th December 2007, 08:12   #4
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