The Z77 OC Formula mainboard from ASRock takes part from their high performance product series and comes shipped inside a large cardboard box, sporting the same color scheme as the product itself. On the front side of the box we can see the logos of the supported technologies along with a drawing of a Lamborghini, which could represent the high speeds that can be achieved when overclocking with extreme cooling solutions:

On the lateral sides we can see more product specifications listed; here we can also find out that the product does not come with the regular ATX format, but CEB, which is an acronym for the Compact Electronics Bay Specification. This format was initially proposed for value servers, as well as workstations based on the XEON CPU. The dimensions of the motherboard are 305mm x 267mm:

On the back side of the box we can see a drawing resembling a dashboard which describes in a modern way some of the motherboard features:

The top side of the box opens like a book and here we can find out more details about the features of the product:

By lifting the top side of the motherboard, we will reveal the motherboard, which is surrounded by protective foam material:

The rest of the bundle is held in a separate cardboard box:

Here we will find one DVD with software and drivers, the Users’ Guide, one Software Setup Guide, the I/O shield, one SLI_Bridge_2S card, 10 OC Stands, a tube of Gelid GC-Extreme Thermal Compound and two extra leaflets, one for the VIRTU MVP tech and the other for ASRock 555:

Inside the User Guide we will find everything that we need to set up the hardware installation: