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TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging
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TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging
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26th July 2023, 06:15
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| [M] Reviewer  Join Date: May 2010 Location: Romania
Posts: 148,812
 |  TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging TSMC on Tuesday announced plans to construct a new advanced chip packaging facility in Tongluo Science Park. The company intends to spend around $2.87 billion on the fab that will employ some 1,500 people when it becomes operational several years from now. https://www.anandtech.com/show/18976...chip-packaging |
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