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SK hynix Collaborates with TSMC on HBM4 Chip Packaging
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SK hynix Collaborates with TSMC on HBM4 Chip Packaging
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19th April 2024, 12:50
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| [M] Reviewer  Join Date: May 2010 Location: Romania
Posts: 148,802
 |  SK hynix Collaborates with TSMC on HBM4 Chip Packaging SK hynix Inc. announced today that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HBM4, or the sixth generation of the HBM family, slated to be mass-produced from 2026, through this initiative. https://www.techpowerup.com/321689/s...chip-packaging |
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