Stefan Mileschin

A tale of tech rivalry and AI ambition

Samsung is eyeing a chip-making method with rival SK Hynix's paws all over it.

It looks like Samsung is set to swallow its pride and play catch-up in the high-stakes race to produce fancy chips for AI using a method championed by its rival SK Hynix.

The buzz is all about these high-bandwidth memory (HBM) chips, which are hotter than a summer in Ibiza, thanks to the AI craze. But while SK Hynix and Micron have been cozying up with Nvidia, Samsung has been left out in the cold.

Samsung has been clinging to this non-conductive film (NCF) tech like a stubborn mule, and it's been giving them grief. But now, they're switching gears and gearing up to give the mass reflow moulded underfill (MR-MUF) method a whirl—a move that's got the tech world gossiping.

Samsung's playing it cool, though, claiming its NCF tech is top-notch for its shiny new HBM3E chips. But whispers say it's already chatting up Japan's Nagase to get its hands on some MUF magic. Still, don't hold your breath—mass production's not on the cards until next year at the earliest.

https://fudzilla.com/news/pc-hardwar...ng-s-chip-flip