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3rd April 2024, 07:57 | #1 |
[M] Reviewer Join Date: May 2010 Location: Romania
Posts: 148,738
| Apple M3 Ultra Chip Could be a Monolithic Design Without UltraFusion Interconnect As we witness Apple's generational updates of the M series of chips, the highly anticipated SKU of the 3rd generation of Apple M series yet-to-be-announced top-of-the-line M3 Ultra chip is growing speculations from industry insiders. The latest round of reports suggests that the M3 Ultra might step away from its predecessor's design, potentially adopting a monolithic architecture without the UltraFusion interconnect technology. In the past, Apple has relied on a dual-chip design for its Ultra variants, using the UltraFusion interconnect to combine two M series Max chips. For example, the second generation M Ultra chip, M2 Ultra, boasts 134 billion transistors across two 510 mm˛ chips. However, die-shots of the M3 Max have sparked discussions about the absence of dedicated chip space for the UltraFusion interconnect. https://www.techpowerup.com/321129/a...n-interconnect |
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