The CPU is packaged in a separate, smaller cardboard box, which sports the same design as we have seen many times before:

Inside, we will get the installation instructions, but also the transparent plastic mold which contains both CPU and case sticker:

Inside the installation leaflet, we will get instructions for both AM3 and AM4 socket processors:

Let’s take a look in more detail at the “main point of attraction”!

First, we do have the Ryzen sticker, which has been designed for the “3” series:

The Ryzen 3 1300X CPU does look identical versus the more powerful SKUs; inside, we can find two CCX modules, each having two CPUs inactive (due to binning), a total of 8MB of L3 cache, 512K L2 cache per active core, a base frequency of 3.4GHz, an all-core boost of 3.6GHz and one 3.7GHz 2-core boost. Since we are dealing with an “X” SKU, the XFR boost (single core) is more consistent to about 3.9GHz!

The processor comes with AMD-specific fonts and I guess that it is not needed to mention again that the manufacturer uses solder between the actual CCXes and the HSF, in order to obtain optimal heat conduction properties:

The top area of the HSF does contain the full CPU name:

In the lower area, we will be able to spot laser-etched serial numbers, and here we did also found out that our sample was manufactured in China:

If we do look on the side, we can reveal the HSF height along with the black sealing gasket:

The bottom side of the CPU is filled with gold-plated pins (1331 to be more exact) and thanks to their specific placement pattern, the installation of the CPU inside the socket is basically fault-proof: