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-   -   Arctic Silver 5 Extensive Review (https://www.madshrimps.be/vbulletin/f6/arctic-silver-5-extensive-review-3597/)

jmke 14th December 2003 17:34

Arctic Silver 5 Extensive Review
 
Arctic Silver 5 compared to its older brother AS3 and Coolermaster Premium (Shin Etsu). How does it perform? We test it on an Intel system, letting each compound "burn in" for 3 days.


http://www.madshrimps.be/gotoartik.php?articID=121

Unregistered 19th December 2003 21:14

sorry but coolermaster premium only has a bit of shin etsu in it and is not shin etsu to do a proper comparison try comparing shin etsu 751 and artic silver 5

jmke 19th December 2003 21:24

Quote:

This thermal interface compound is developed by Shin Etsu Chemical
anyways, can't get my hands on Shin Etsu 751 here, but if I ever find it I will surely do a comparison.

it's clearly marked "Coolermaster" in the test, so you can't confuse it with any other "shin etsu" out there.

where did you get your 751?

Unregistered 8th January 2004 14:56

Wow, that conclusion came out of nowhere. You just finished saying that AS5 was no better then the competitiors, but yet it's the greatest thing.

When will "enthusiasts" get it? The newest is not always the greatest. I swear, if that extra .5 C gives you even 1 more MHZ overclock, I will personally buy, and send all of you a lifetime supply of AS5.

jmke 8th January 2004 15:05

my testing methodolgy was flawed as I put way too much paste between the CPU & heatsink.

I'm planning on doing an update of this article, also including the tests done on an AMD setup.

as you will read from other reviews of AS5 (http://www.xtremesystems.org/modules...wcontent&id=29 being one of my favourites) AS5 has a 3-5°C lead over AS3. And you can be sure that lower temps mean better overclocks (10-20mhz more.. nothing spectacular, but every bits helps ;))

jmke 11th January 2004 21:15

I started some extra re-testing with the AS5, here's how the CPU should look like after you've removed the heatsink, the amount of "goo" applied is considerably less then I used for the review.

no results as of yet on for temps, but those will follow soon :)

Tum0r 12th January 2004 08:08

Quote:

Originally posted by jmke


anyways, can't get my hands on Shin Etsu 751 here, but if I ever find it I will surely do a comparison.

where did you get your 751?

I believe Teus has a tube of shin etsu G751 that I have send him to review @ [M]
Isn't he a (staff)memeber of [M]

He has the tube for quite some time...?

I'm a little confused?

jmke 12th January 2004 08:44

darn, I saw him this saturday, I'll ask him to send it my way :)

jmke 10th March 2004 19:59

new thermal goop coming my way (thanks TeuS!)
I'm ready for re-testing

IKilledMyAGOIA 10th March 2004 20:29

you dont cover the entire ihs?

doesnt that defeat the purpose? [/my own intel cooling ignorance]

silencer 10th March 2004 22:44

it is only in the center of the ihs that you can find the core of the cpu.

So if you have a good contact between those 2 you have no problem.

jmke 10th March 2004 23:11

Quote:

Originally posted by IKilledMyAGOIA
you dont cover the entire ihs?
check guidelines AS website :)

Sidney 29th March 2004 02:56

I've been testing the AS5 and Ceramique versus the AS3. For weeks I couldn't find much of a difference, may be 1 to 1.5C at best. It's very difficult to test thermal compound, unless it is done in a lab with every application being consistant with one another. There are just too many variables.

The only one thing I noticed that is; the AS5 is thicker and as if it" glues" onto the heatspreader and base of the heatsink, when removing the heatsink it would pull the processor out of the socket. This happened to me several times with P4. I experienced the same with Intel OEM compound that comes with 3.06 processor with copper base heatsink.

TeuS 29th March 2004 06:08

I've removed the heatsink from my P4 2.53 multiple times, and the CPU got always pulled out of the socket. I've used both the stock thermal tape and AS Céramique. haven't tried AS5 yet

and I agree, there's not much of a difference between all thermal pastes. based on my review and JMke's review I concluded most stock thermal compounds perform about the same, while the top quality compounds do about a degree better then that

for most users, the choice of a thermal compound doesn't rely anymore on the performance because they're all the same. what matters now is the ease of use, the price and the availability


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