Western Digital Begins to Sample QLC BiCS4: 1.33 Tbit 96-Layer 3D NAND
 

Western Digital has started sampling its 96-layer 3D NAND chips featuring QLC architecture that stores four bits per cell. The chip happens to be the world’s highest-capacity 3D NAND device. The company expects to commence volume shipments of this memory chip already this calendar year.

Western Digital’s 96-layer BICS4 3D QLC NAND chip can store up to 1.33 Tb of raw data, or around 166 GB. The IC will be initially used for consumer products Western Digital sells under the SanDisk brand, so think of memory cards (e.g., high-capacity SD and microSD products), USB drives, and some other devices. The manufacturer expects its 3D QLD NAND memory to be used in a variety of applications, including retail, mobile, embedded, client, and enterprise, but does not elaborate on timing at this point.

The 1.33-Tb BICS4 IC is Western Digital’s second-gen 3D QLC NAND device. Last year the company announced its BICS3 64-layer 3D QLC chips featuring a 768 Gb capacity, but it is unclear whether they have ever been used for commercial products. Meanwhile, it is clear that the device was used to learn about 3D QLC behavior in general (i.e., endurance, read errors, retention, etc.)

https://www.anandtech.com/show/13102...er-3d-qlc-nand