VIA Chooses Tensilica for Solid State Drive (SSD) Chip Design
 

Tensilica, Inc. today announced that VIA has selected Tensilica's Xtensa dataplane processors (DPUs) for a system-on-chip (SOC) design for solid state drives (SSDs). After conducting a technical evaluation, VIA determined that Tensilica's DPUs provide over four times the performance of competing processors on key algorithms used to benchmark competitive alternatives.

SSDs require faster and more efficient data management and manipulation to increase their throughput (measured in Input/Output Operations per Second, or IOPS). With conventional processors, increasing the clock speed is the common way to increase performance. However, this increases energy consumption and die size, especially as speeds increase so much that designers are forced to move to more complex multi-core solutions.

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