UMC Enters Volume Production for TSV Process that Enables AMD Radeon R9 Fury X
 

United Microelectronics Corporation, a leading global semiconductor foundry, today announced that it has entered volume production for the Through-Silicon-Via (TSV) technology used on the AMD Radeon R9 Fury X, the flagship GPU in the recently announced Radeon R 300 Series of graphics cards. The AMD Radeon R9 Fury X GPU utilizes UMC's TSV process technology and die-stacking to fuse HBM DRAM with AMD's GPU on a silicon interposer, enabling the GPU to deliver unmatched memory bandwidth of 4096-bit and quadruple the performance-per-watt over the current GDDR5 industry standard.

"AMD has a successful history of delivering cutting-edge GPU products to market," said S.C. Chien, vice president of Corporate Marketing and co-chair of the TSV committee at UMC. "This volume production milestone is the culmination of UMC's close TSV collaboration with AMD, and we are happy to bring the performance benefits of this technology to help power their new generation of GPU products. We look forward to continuing this fruitful partnership with AMD for years to come."

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