TSMC: N7+ EUV Process Technology in High Volume, 6nm (N6) Coming Soon
 

TSMC announced on Monday that its customers have started shipping products based on chips made by TSMC using its N7+ (2nd Generation 7 nm) process technology that uses extreme ultraviolet lithography (EUVL) for up to four layers. The company also said that its clients are on track to tape out chips to be made using N6 node next year.

When compared to N7 (1st Generation 7 nm) that solely relies on deep ultraviolet lithography, TSMC lists its N7+ process as providing a 15% to 20% higher transistor density as well as 10% lower power consumption at the same complexity and frequency. Furthermore, after less than two quarters in production, TSMC is stating that N7+ now matches N7’s yields, which has been used for over a year now.

Use of EUVL enables TSMC to reduce usage of multipatterning technologies when printing highly complex circuits. This also means that TSMC’s EUV tools can offer output power of greater than 250 watts for day-to-day operations while reaching target goals for availability.

https://www.anandtech.com/show/14954...vm-n6-on-track