TSMC, Intel, Samsung Agree on 450mm For The Future
 

Three major players in integrated circuit manufacturing -- Samsung Electronics, Intel Corporation, and Taiwan Semiconductor Manufacturing (TSMC) -- have made the announcement of an agreement for a new, even larger wafer production standard. The current wafer plants crank out 300mm discs, but going forward, the three companies feel that the need for another graduation in area is necessary. They will also work with International Sematech to insure a viable set of standards for the new wafers.

Though TSMC, the world's largest semiconductor manufacturer, has recently entered into an agreement with two other Taiwanese chip makers to build $14.7 billion worth of new 300mm fabs, the idea of further progress and efficiency for the future has not been brushed aside. Moving from the current 300mm to the planned 450mm platters will save more money, more energy and cause less pollution overall, as well as allow the industry to pile more microchips into a single wafer.

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