TSMC: 5nm on Track for Q2 2020 HVM, Will Ramp Faster Than 7nm
 

TSMC’s 5 nm (N5) manufacturing technology is projected to provide significant benefits when it comes to performance, power, and area scaling, which is why the contract maker of semiconductors expects a tangible number of its customers to adopt this process. And, with a forecast for aggressive demand paired with some early preparation in installing new equipment, TSMC believes that its N5 technology will ramp even quicker than its 7 nm (N7) process.

In a bid to boost its production capacities, TSMC recently increased its capital expenditures for 2019 from $10 billion - $11 billion to $14 billion - $15 billion. TSMC is particularly invested in buying equipment for its cutting-edge nodes, such as ASML’s Twinscan NXE step-and-scan systems for processes that use extreme ultraviolet lithography (EUVL) for select layers. At present, TSMC’s Fab 15 is making SoCs using N7+, whereas its Fab 18 (the first phase of equipment move-in was completed in March 2019) is on-track to produce N5 chips in high volume starting Q2 2020.

The new tools that will be bought in the coming months are expected to be installed in 2020 and this is when the company will be able to quickly ramp production of chips using its N7, N7+, N7P, N6, N5, and N5P process technologies. The company is confident that it will have a very high market share with its 5 nm nodes.

https://www.anandtech.com/show/15016...aster-than-7nm