Toshiba Weds 3D NAND and TSV Toshiba on Wednesday introduced its first BiCS 3D TLC NAND flash chips with 512 GB and 1 TB capacities. . The new ICs stack 8 or 16 3D NAND devices using through silicon vias (TSVs) and are currently among the highest capacity non-volatile memory stacks available in the industry. Commercial products powered by the 512 GB and 1 TB packages are expected to hit the market in 2018, with an initial market focus on high-end enterprise SSDs http://www.anandtech.com/show/11627/...-tsvs-1tb-dies |
All times are GMT +1. The time now is 17:07. |
Powered by vBulletin® - Copyright ©2000 - 2024, Jelsoft Enterprises Ltd.
Content Relevant URLs by vBSEO