Toshiba's 768Gb 3D QLC NAND Flash Memory
 

Toshiba last week announced its first 3D NAND flash memory chips featuring QLC (quadruple level cell) BiCS architecture. The new components feature 64 layers and developers of SSDs and SSD controller have already received samples of the devices, which Toshiba plans to use for various types of storage solutions.

Toshiba’s first 3D QLC NAND chips feature 768 Gb (96 GB) capacity and uses 64 layers, just like the company’s BICS3 chips with 256 Gb and 512 Gb capacities launched in 2016 and 2017. Toshiba does not share further details about its 3D QLC NAND IC (integrated circuit), such as page size, the number of planes as well as interface data transfer rate, but expect the latter to be high enough to build competitive SSDs in late 2018 to early 2019 (that’s our assumption). Speaking of applications that Toshiba expects to use its 3D QLC NAND ICs, the maker of flash memory mentions enterprise and consumer SSDs, tablets and memory cards.

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