Toshiba about to issue 1TB flash chip
 

Has begun to sample

Troubled Japanese chipmaker Toshiba has begun shipping samples of its third-generation 3D NAND memory product.

The new 512 gigabit, 64-layer device has three-bit-per-cell triple-level cell (TLC) technology and will be part of Tosh’s BiCS FLASH product line. This technology will enable a 1-terabyte chip solution later this year.

For those who came in late, BiCS FLASH is a 3D flash memory stacked cell structure.

Sample shipments of the new 512Gb devices have begun, with mass production scheduled for the second half of 2017.

http://fudzilla.com/news/42970-toshi...1tb-flash-chip