Thermaltake introduces the Mini Typhoon - S775/S939/AM2
 

Best performance, supports up to TDP 130W

Heatsink:
‧6 heatpipes, maximized heat transfer
‧All copper structure, provides extremely fast heat conductivity
‧0.2mm thick copper fins and perfect fin rate, perfect weight-to-performance ratio
‧Waved fins to reduce wind shearing noise

3 in 1 application:
‧For LGA775: push pin design for faster install
‧For K8 and latest socket AM2, tool-less clip, easy to install


RX Type Flow:
‧Powerful 9238 reversed fan to reduce the noise from air-rebounding, only 18dBA