SK Hynix stacks 3D NAND chips to the sky
 

NAND flash write endurance seems to decrease as manufacturing processes get smaller. The time between process shrinks seems to grow with every node, even at big research spenders like Intel. With these two limitations in mind, one way to increase the capacity and performance of NAND flash chips is to stack more layers on each die. This is the approach SK Hynix has taken with its latest 256 Gb (or 32 GB) 72-layer 3D NAND chips.

http://techreport.com/news/31718/sk-...ips-to-the-sky