Samsung begins mass production of 4GB HBM2 memory chips Just under a week ago, JEDEC updated the High-Bandwidth Memory standard with provisions for bigger, faster memory packages. Hot on JEDEC's heels, Samsung has taken the wraps off its mass-production 4GB HBM2 chips this evening. The company says it's fabricating these 4GB dies on its 20-nm process. Each of these packages comprises four 8Gb core dies atop a buffer die at the base of the stack. Consistent with JEDEC's specifications, each of these HBM2 dies will offer 256 GB/s of bandwidth. For comparison, Samsung says that ... http://techreport.com/news/29614/sam...2-memory-chips |
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