Stefan Mileschin

This year’s Galaxy S10 has been in a bit of an odd situation: Although Samsung continued to dual-source its SoCs, using both its own Exynos 9820 SoC as well as Qualcomm’s Snapdragon 855, the phone found itself in the unusual situation of pitting 8nm silicon against 7nm silicon from TSMC. So although the new Exynos 9820 did fairly well in testing and improved a lot over the Exynos 9810, the chip seemingly still had disadvantages against the competition when it came to power efficiency, likely linked to its process technology disadvantages. On top of the power efficiency disadvantages, the chip also had a notable die area disadvantage versus the Snapdragon, coming in at 127mm² versus the smaller 73mm² competition.

Samsung’s 7nm EUV process node was noted as having started mass production back in October of last year, although we’re not sure exactly which chip this was referring to, and we had hopes that it would be the chip for the S10 but alas it was not to be.

This time around, Samsung is seemingly bridging the gap with the introduction of the new Exynos 9825 – a 7nm LPP refresh of the Exynos 9820.

https://www.anandtech.com/show/14645...v-silicon-chip