Rambus releases details of actual product
 

Next-gen high bandwidth memory technology

Patent outfit Rambus has paused its business to invent some new high bandwidth memory technology.

HBM3 was mentioned in presentations by Samsung and SK hynix at the Hot Chips Symposium last year. It is claimed HBM3 would improve on density, bandwidth, cost, and power consumption but there were few other details.

Samsung's HBM3 presentation hinted that HBM3 density would be 2x or better, peak bandwidth would be 2x or better and IO/Core voltage would be "much less", compared to HBM2.

http://fudzilla.com/news/45166-rambu...actual-product