Intel reveals Tremont 10nm microarchitecture
 

Chief architect: Expect 30 to 40 percent uplift

Intel has shared a few more details about the Intel Tremont low power Microarchitecture at the Linley Fall Processor Conference in Santa Clara and we had the chance to chat with Stephen Robinson, Senior Principal Engineer and Intel Tremont Chief Architect.

Many might recognize the Tremont name as Intel mentioned it several times, the first time in December of last year. Tremont are small cores packed with 3D packaging method called Foveros in Lakefield processors. Robinson did highlight that Lakefield found its way to very innovative Surface Neo products.

“Tremont is Intel’s most advanced low-power x86 architecture to date. We focused on a range of modern, complex workloads, while considering networking, client, browser and battery so that we could raise performance efficiently across the board. It is a world-class CPU architecture designed for enhanced processing power in compact, low-power packages.”

--Stephen Robinson, Intel Tremont Chief Architect

Once we saw the top-level design and the changes in the pipeline, it became clear that this is a big change compared to a previous low power architecture called Goldmont Plus released in December 2017. Goldmont Plus is the core inside of the Gemini Lake SoC.

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