Stefan Mileschin

Today at the International Supercomputing Conference in Leipzig, Germany, Intel unveiled details on the next-generation Intel® Xeon Phi™ processor codenamed Knights Landing, which includes the newly integrated Intel® Omni Scale Fabric, an end-to-end interconnect optimized for fast data transfers and better efficiency. Knights Landing will feature high-bandwidth on-package memory and deliver up to three times the performance of the prior generation while using less energy. Intel technology was also showcased throughout the conference with Intel® Xeon® processors powering 85% of systems in the newly published TOP500 list, underscoring their role as the fundamental building block for the world's most powerful supercomputers.

http://www.hardocp.com/news/2014/06/...on_processors/