Intel-Micron Share Additional Details of Their 3D NAND
 

Today must be the busiest day in the world of NAND. Earlier today, Toshiba announced that it has begun shipments of its 48-layer 128Gbit 3D NAND part and now a few hours later Intel and Micron held a joint webinar that revealed a few new details about the companies' 3D NAND process. Intel-Micron originally unveiled their 3D NAND in November last year and disclosed that the first generation product will be a 32-layer 256Gbit (32GB) MLC part, which can also operate in TLC mode to bring the capacity per die to 384Gbit (48GB).

http://www.anandtech.com/show/9114/i...-their-3d-nand