IBM doubles CPU cooling capabilities with simple manufacturing change

jmke · 26th March 2007, 11:37

According to a new paper released at the IEEE Semi-Therm conference, IBM has discovered a way to dramatically improve processor cooling. Unlike some other recent cooling breakthroughs, IBM's discovery appears to be one that should be relatively inexpensive to implement, and could have a significant impact on consumer microprocessors in the near future. Without fundamentally changing the approach to CPU cooling today and without the use of more advanced setups like water coolers, IBM says that they can double CPU cooling capacity while making it easier and safer to do so.

http://arstechnica.com/news.ars/post...ng-change.html

jmke · 26th March 2007, 11:38

"The results are quite impressive. Paste thickness could be reduced by a third, and the pressure required to properly fit a CPU cooler on top of a core was cut in half. All of this, and IBM says that cooling capabilities are effectively doubled."

interesting

26th March 2007, 13:19

the passive cooled compents could use some better paste + this technique as well (NB, SB, PWM)

26th March 2007, 22:00

mmm, wtb

26th March 2007, 11:37	#1
jmke Madshrimp Join Date: May 2002 Location: 7090/Belgium Posts: 79,021	IBM doubles CPU cooling capabilities with simple manufacturing change According to a new paper released at the IEEE Semi-Therm conference, IBM has discovered a way to dramatically improve processor cooling. Unlike some other recent cooling breakthroughs, IBM's discovery appears to be one that should be relatively inexpensive to implement, and could have a significant impact on consumer microprocessors in the near future. Without fundamentally changing the approach to CPU cooling today and without the use of more advanced setups like water coolers, IBM says that they can double CPU cooling capacity while making it easier and safer to do so. http://arstechnica.com/news.ars/post...ng-change.html __________________

26th March 2007, 11:38	#2
jmke Madshrimp Join Date: May 2002 Location: 7090/Belgium Posts: 79,021	"The results are quite impressive. Paste thickness could be reduced by a third, and the pressure required to properly fit a CPU cooler on top of a core was cut in half. All of this, and IBM says that cooling capabilities are effectively doubled." interesting __________________

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26th March 2007, 13:19	#3
Rutar Posts: n/a	the passive cooled compents could use some better paste + this technique as well (NB, SB, PWM)