I'M Intelligent Memory Debuts 8 Gb DDR3 Components, 16 GB Modules
 

I'M Intelligent Memory, a Hong Kong based fabless DRAM manufacturer, announces availability of the world's first 8 Gigabit (Gb) DDR3 components with a single chip-select, doubling the amount of memory per chip compared to other DDR3 DRAM devices on the market. Based on these new 8 Gb components, I'M is also introducing the first 16 Gigabyte (GB) DDR3 UDIMM and SO-DIMM memory modules with optional ECC error-correction.

The JEDEC specification JESD79-3 has always allowed an 8 Gb density for DDR3 memory devices. While most DRAM manufactures are waiting for a 2x nm process to fit such high memory capacity into a single DRAM IC package, I'M has developed its own a revolutionary way to manufacture 8 Gb DDR3 components with single chip-select utilizing existing 30 nm manufacturing technologies.

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