Stefan Mileschin

Our most popular news during the week of Computex was, without a doubt, AMD’s announcement of the next generation of Threadripper. The new chips, coined Threadripper 2, are set to have up to 32 cores on board and be socket compatible with current X399 motherboards. However, the new chips will be rated at a 250W TDP, which as a result might be limiting to some of the current motherboards on the market. While all of the new CPUs will work in all of the current X399 motherboards, overclocking may be limited. As a result, some manufacturers are working on an X399 motherboard refresh, and GIGABYTE is stepping up with its new top-end halo motherboard, the X399 Aorus.

Aside from all the metallic looking pieces, GIGABYTE’s new motherboard is taking cues from its return to a more traditional finned heatsink design for the power delivery. The new 13 phase motherboard (10+3) is using a connected direct-contact heatpipe between the two main heatsinks to afford a better cooling scenario. Beyond this the motherboard has DRAM and PCIe slot protection, and a massive chipset heatsink area that also supports heatsink cooling for three M.2 SSDs.

GIGABYTE went into a bit more detail on its heatsink cooling. The main finned heatsink is copper, not aluminium, for better cooling performance. The company is also using higher-grade thermal pads in the VRM region, rated at 4-5 watts per kelvin, rather than a standard 1.8 W/K as seen on most other motherboards. The exact rating is still TBD as the engineers/bean counters determine which is best, however GIGABYTE expects a better thermal response here and says it will be crucial for the new CPUs.

https://www.anandtech.com/show/12979...lo-motherboard