Biwin Announces e-MMC SSD-on-a-Chip for Embedded Computing Applications
 

Embedded computing OEMs are seeking ways to shorten their design cycles and save precious space inside their systems. Biwin, an industry leader in flash storage products, today announced an e-MMC SSD in a 169-ball BGA chip that addresses both those demands, enabling customers to design in a complete storage solution on a single chip with an industry standard interface.

Biwin's new e-MMC SSDs are offered in capacities from 2 GB to 64 GB. They integrate both flash and a full SSD controller into a single chip, featuring advanced SSD features such as ECC, wear leveling and bad block management. They also include two key new features for embedded memory applications: power-on boot and explicit sleep mode, which translate to significant benefits for the end-user.

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