Arctic Silver 5 Extensive Review - Page 2

10th March 2004, 22:44

it is only in the center of the ihs that you can find the core of the cpu.

So if you have a good contact between those 2 you have no problem.

jmke · 10th March 2004, 23:11

Quote:

Originally posted by IKilledMyAGOIA
you dont cover the entire ihs?

check guidelines AS website

Sidney · 29th March 2004, 02:56

I've been testing the AS5 and Ceramique versus the AS3. For weeks I couldn't find much of a difference, may be 1 to 1.5C at best. It's very difficult to test thermal compound, unless it is done in a lab with every application being consistant with one another. There are just too many variables.

The only one thing I noticed that is; the AS5 is thicker and as if it" glues" onto the heatspreader and base of the heatsink, when removing the heatsink it would pull the processor out of the socket. This happened to me several times with P4. I experienced the same with Intel OEM compound that comes with 3.06 processor with copper base heatsink.

29th March 2004, 06:08

I've removed the heatsink from my P4 2.53 multiple times, and the CPU got always pulled out of the socket. I've used both the stock thermal tape and AS Céramique. haven't tried AS5 yet

and I agree, there's not much of a difference between all thermal pastes. based on my review and JMke's review I concluded most stock thermal compounds perform about the same, while the top quality compounds do about a degree better then that

for most users, the choice of a thermal compound doesn't rely anymore on the performance because they're all the same. what matters now is the ease of use, the price and the availability

29th March 2004, 02:56	#13
Sidney Member Join Date: Mar 2004 Posts: 15,738	I've been testing the AS5 and Ceramique versus the AS3. For weeks I couldn't find much of a difference, may be 1 to 1.5C at best. It's very difficult to test thermal compound, unless it is done in a lab with every application being consistant with one another. There are just too many variables. The only one thing I noticed that is; the AS5 is thicker and as if it" glues" onto the heatspreader and base of the heatsink, when removing the heatsink it would pull the processor out of the socket. This happened to me several times with P4. I experienced the same with Intel OEM compound that comes with 3.06 processor with copper base heatsink. __________________ lazyman Opteron 165 (2) @2.85 1.42 vcore AMD Stock HSF + Chill Vent II

Similar Threads
Thread	Thread Starter	Forum	Replies	Last Post
Arctic Cooling ARCTIC MX-2 & MX-3 Thermal Paste Review	jmke	WebNews	0	9th October 2009 10:45
RIP Keith Suppe , Liquid3D	jmke	WebNews	16	7th September 2009 12:16
Arctic Cooling Freezer XTREME Rev.2 CPU Cooler Review	jmke	WebNews	0	6th July 2009 14:47
Arctic Silver Products	Sidney	WebNews	0	8th July 2005 14:55
Arctic Silver ArctiClean Review	Da_BoKa	WebNews	0	25th April 2005 10:12
Arctic Silver ArctiClean Review	jmke	Articles & Howto's	25	22nd January 2005 23:05
Arctic Silver 5	jmke	Articles & Howto's	35	8th December 2003 17:47
Arctic Silver 5 Review	Tum0r	WebNews	0	9th October 2003 15:21

10th March 2004, 22:44	#11
silencer Posts: n/a	it is only in the center of the ihs that you can find the core of the cpu. So if you have a good contact between those 2 you have no problem.

29th March 2004, 06:08	#14
TeuS Posts: n/a	I've removed the heatsink from my P4 2.53 multiple times, and the CPU got always pulled out of the socket. I've used both the stock thermal tape and AS Céramique. haven't tried AS5 yet and I agree, there's not much of a difference between all thermal pastes. based on my review and JMke's review I concluded most stock thermal compounds perform about the same, while the top quality compounds do about a degree better then that for most users, the choice of a thermal compound doesn't rely anymore on the performance because they're all the same. what matters now is the ease of use, the price and the availability