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Arctic Silver 5 Extensive Review
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Old 10th March 2004, 23:44   #11
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it is only in the center of the ihs that you can find the core of the cpu.

So if you have a good contact between those 2 you have no problem.
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Old 11th March 2004, 00:11   #12
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Quote:
Originally posted by IKilledMyAGOIA
you dont cover the entire ihs?
check guidelines AS website
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Old 29th March 2004, 03:56   #13
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I've been testing the AS5 and Ceramique versus the AS3. For weeks I couldn't find much of a difference, may be 1 to 1.5C at best. It's very difficult to test thermal compound, unless it is done in a lab with every application being consistant with one another. There are just too many variables.

The only one thing I noticed that is; the AS5 is thicker and as if it" glues" onto the heatspreader and base of the heatsink, when removing the heatsink it would pull the processor out of the socket. This happened to me several times with P4. I experienced the same with Intel OEM compound that comes with 3.06 processor with copper base heatsink.
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Old 29th March 2004, 07:08   #14
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I've removed the heatsink from my P4 2.53 multiple times, and the CPU got always pulled out of the socket. I've used both the stock thermal tape and AS Céramique. haven't tried AS5 yet

and I agree, there's not much of a difference between all thermal pastes. based on my review and JMke's review I concluded most stock thermal compounds perform about the same, while the top quality compounds do about a degree better then that

for most users, the choice of a thermal compound doesn't rely anymore on the performance because they're all the same. what matters now is the ease of use, the price and the availability
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