Winbond Shrinks SPI Flash Chips
 

Winbond Electronics released a new line of serial peripheral interface flash (SPI Flash) memory chips designed to have tiny board footprints (sizes). 8-pin SPI Flash memory chips are in almost every part of today's computers, be it the chip that stores motherboard or VGA BIOS, the one that stores third-party controller firmware, or even boot ROM of network cards. Its applications get even broader with consumer electronics devices. Winbond launched new 8-pin SPI Flash chips in ultra-thin small-outline no-lead (USON) and wafer-level-ball-grid-array (WLBGA) form-factors, that have 20% smaller board footprints than common WSON and SOIC packages.

Winbond's new 6 mm² USON SPI Flash chips come in sizes of 512 Kb, 1 Mb, 2 Mb, 4 Mb, and 8 Mb, and with voltage options of common 2.5V and 3V. Low-power 1.8V options are available, too. The WLBGA SPIFlash chips will be available in 8 Mb and 16 Mb capacities, with package sizes of 3.4 mm² and 4.8 mm², respectively. Currently these chips are built on the more common 90 nm bulk manufacturing process, but Winbond expects to transition to 58 nm bulk process, driving down costs, in the future.

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