Stefan Mileschin

The next generation of high-performance Intel Xeons will be the second stage of Intel rearranging its professional stack. Stage one was separating chipset requirements of low core count Xeons from the consumer counterparts, but stage two to occur later this year will be something to wrap your head around. We still haven’t confirmed most of the salient details, such as significant changes in the naming and strategy when it comes to socket and die differentiators, but what we do know is that the large E5-class Xeons (some of which may or may not get a name change from –EP to –SP) will be in the LGA3647 socket, which is exactly where the current generation of Xeon Phi, Knights Landing (KNL), also sits as they will be pin compatible. So for the most part, E5 CPUs will move from the current LGA2011-3 sockets up to a much larger design, and rather than go into the details of what that means, this news post is more about seeing motherboards that support them in the wild. We expect to hear more about the new Skylake-SP Xeon platform in the summer, probably at IDF in August, but for now we get to gaze on accidental leaks like this one.

http://www.anandtech.com/show/11277/...erboard-leaked