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Taiwan Semiconductor Manufacturing Company and United Microelectronics Corp., two leading contract makers of semiconductors, are ramping up their 300mm manufacturing capacities in order to better serve their customers and also improve their competitive positions against Globalfoundries, a new player on the contract semiconductor market, and each other.

TSMC plans to boost output of fab 14 located in southern Taiwan at the Tainan Science Park to 6 thousand wafers by the end of 2009, and to about 35 thousand wafers in 2010, according to a BNP Paribas report cited by DigiTimes web-site. Fab 14 processes 300mm wafers at 40nm manufacturing process. It is believed that the output is increased in order to fulfill demand for Intel Atom-based system-on-chips products.

http://www.xbitlabs.com/news/other/d...apacities.html

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