Stefan Mileschin

Toshiba Corporation and Toshiba America Electronic Components, Inc., (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of its new embedded NAND flash memory modules. The new modules integrate NAND chips fabricated with Toshiba's 19nm second generation process technology and are fully compliant with the latest e-MMCTM[1] standard. Designed for application in a wide range of digital consumer products, the new modules are targeted to smartphones, tablet PCs and digital video cameras.

Demand continues to grow for large density NAND flash memory chips that support high resolution video and deliver enhanced storage. This is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs. Toshiba is meeting this demand by reinforcing its line-up of high density memory products.

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