Stefan Mileschin

24nm NAND with embedded ECC enables easy migration from 4xnm Raw SLC NAND to leading edge technology

Düsseldorf, 25th February 2014 – Toshiba Electronics Europe (TEE) has expanded its range of 24nm BENANDTM[1] single level cell (SLC) NAND flash memory with embedded 8bit error correction (ECC). The launch of the new 8Gb 24nm SLC BENAND enables manufacturers to utilise the latest 24nm technology in devices that were designed to use 4xnm NAND, extending the product life of consumer electronics, multimedia devices, smart meters, intelligent lighting systems and industrial technology.



BENAND removes the burden of ECC from the host processor and enables designers to utilize leading edge process NAND flash technology. To ensure easy migration, the new BENAND have been designed so that features such as Page/Block size, spare area size, Commands, Interface and Package are kept the same as legacy 4xnm SLC NAND.



The price of NAND Flash memory made at advanced process nodes is reduced, but the smaller cells become more vulnerable to program/erase stresses. This requires more complex ECC to maintain the desired levels of reliability - for example small density 4xnm SLC NAND requires 1bit ECC, 3xnm SLC NAND requires 4bit ECC and 2xnm SLC NAND requires 8bit ECC.



ECC has traditionally been built into the host controllers, often making switching to newer, more cost effective NAND an expensive and time-consuming task as the host processor must be changed to enable the required level of error correction. However, BENAND rewrites this paradigm by moving the ECC onto the NAND chip and enabling legacy controllers to be used with the latest NAND technology – reducing BOM and system design costs while maintaining the high reliability of SLC NAND.



This introduction of 8Gb extends the line-up of BENAND from 1Gb to 8Gb, which is available in TSOP and BGA packages and in industrial and consumer operating temperature ranges.




About Toshiba



Toshiba Electronics Europe (TEE) is the European electronic components business of Toshiba Corporation, which is ranked among the world’s largest semiconductor vendors. TEE offers one of the industry's broadest IC and discrete product lines including high-end memory, microcontrollers, ASICs and ASSPs for automotive, multimedia, industrial, telecoms and networking applications. The company also has a wide range of power semiconductor solutions as well as storage products like HDDs, SSDs, SD Cards and USB sticks.



TEE was formed in 1973 in Neuss, Germany, providing design, manufacturing, marketing and sales and now has headquarters in Düsseldorf, Germany, with branch offices in France, Italy, Spain, Sweden and the United Kingdom. TEE employs approximately 300 people in Europe. Company president is Mr. Takashi Nagasawa.



Toshiba Corporation is a world-leading diversified manufacturer, solutions provider and marketer of advanced electronic and electrical products and systems. Toshiba Group brings innovation and imagination to a wide range of businesses: digital products, including LCD TVs, notebook PCs, retail solutions and MFPs; electronic devices, including semiconductors, storage products and materials; industrial and social infrastructure systems, including power generation systems, smart community solutions, medical systems and escalators & elevators; and home appliances. Toshiba was founded in 1875, and today operates a global network of more than 590 consolidated companies, with 206,000 employees worldwide and annual sales surpassing US$61 billion.



For more company information visit Toshiba's web site at www.toshiba-components.com