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Team Group Plans Wide Temperature Product Launch in 2012 ESEC Show in Japan Team Group Plans Wide Temperature Product Launch in 2012 ESEC Show in Japan
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Team Group Plans Wide Temperature Product Launch in 2012 ESEC Show in Japan
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Old 3rd May 2012, 08:36   #1
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Default Team Group Plans Wide Temperature Product Launch in 2012 ESEC Show in Japan

The 15th ESEC, the largest embedded system exhibition in Japan, will be held from 5/9 (Wed.) ~ 5/11 (Fri.) at Tokyo International Exhibition Center. This is an annual event held specifically for embedded system integration companies, manufacturers of hardware/software related, and distributors. Team Group Inc. has been working our way in Japan for more than 3 years. Last year, we made a big hit first time in this exhibition, and we are ready to hit a homerun this year. We are going to demonstration our determination into the military and industrial grade/SI markets.

This year is the second time we participate in ESEC. We are going to present the latest industrial control memory module series, including Registered DIMM, ECC U-DIMM, VLP U-DIMM and Micro-DIMM. All of the products are produced according to JEDEC standards using the chips of original manufacturers. They have passed various strict and careful verification analyses and temperature tests. The stability and durability of products are improved with 30u" PCB. Products with low voltage demand are the embodiment of energy efficiency. The newly developed high frequency and large volume memory modules give the full series of products the capability to satisfy different customization needs for medical equipment, monitoring system and industrial computers. The quality is better, and performance more powerful.

http://www.techpowerup.com/165277/Te...-in-Japan.html
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