Spansion and SK Hynix Announce Strategic NAND Alliance
 

Spansion Inc. and SK Hynix today announced an alliance to deliver Spansion SLC NAND products at the 4x, 3x, and 2x nodes to the embedded market. The first Spansion SLC NAND products resulting from this alliance will be available beginning in the second quarter of 2012. As part of the relationship, the companies will enter into a patent cross-licensing agreement.

Spansion's NAND products complement its NOR offering and complete its product line, which is targeted at embedded applications such as automotive, industrial and telecommunications. Spansion's high performance and high reliability SLC NAND product portfolio will come with Spansion's recognized customer support and commitment for longevity of supply, which is highly valued in the embedded market, where Spansion has established relationships. Spansion will apply its stringent process for qualification, testing, extended temperature support and packaging to its NAND products. The company plans to introduce a family of NAND products over the next few quarters.

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